- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Patent holdings for IPC class H05K 3/20
Total number of patents in this class: 778
10-year publication summary
65
|
75
|
80
|
70
|
60
|
55
|
42
|
45
|
29
|
13
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
JX Nippon Mining & Metals Corporation | 1576 |
19 |
Shinko Electric Industries Co., Ltd. | 1186 |
17 |
Ibiden Co., Ltd. | 1724 |
15 |
Sumitomo Electric Industries, Ltd. | 14131 |
14 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
14 |
Fujikura Ltd. | 2777 |
12 |
Nitto Denko Corporation | 7879 |
11 |
Sumitomo Wiring Systems, Ltd. | 9367 |
11 |
Hitachi Chemical Company, Ltd. | 2455 |
10 |
AutoNetworks Technologies, Ltd. | 5809 |
10 |
Murata Manufacturing Co., Ltd. | 22355 |
9 |
Avary Holding (Shenzhen) Co., Limited. | 275 |
9 |
Lumet Technologies Ltd. | 16 |
8 |
Robert Bosch GmbH | 40953 |
7 |
Yazaki Corporation | 6282 |
7 |
LG Innotek Co., Ltd. | 6758 |
7 |
Jumatech GmbH | 21 |
7 |
Kiekert Aktiengesellschaft | 1296 |
7 |
Landa Labs (2012) Ltd. | 131 |
7 |
Mitsubishi Materials Corporation | 2378 |
7 |
Other owners | 570 |